|
It is the constant changes in technology which have driven forward the end markets in electronics, and similarly the technology required to make these products is also evolving. This section looks at the techniques and equipment that are driving the industry forward.
|
Latest Technology Article
Trends in Test part 3: Peer-to-Peer Computing
In this five-part series, National Instruments draws upon its knowledge and experience of a wide range of industries to identify key technologies and methodologies impacting test and measurement in 2010. This third instalment focuses on peer-to-peer computing and the benefits it offers the test industry. ...FULL STORY
15 July 2010
Multichannel RF test
In this five-part series, National Instruments draws upon its knowledge and experience of a wide range of industries to identify key technologies impacting test and measurement in 2010. This second instalment focuses on testing next-generation wireless devices. ...FULL STORY
16 June 2010
Safety first with UV light (11 May 2010)
New regulations have been introduced that affect users of the UV lamps typically used for curing processes in the electronics industry. Paul Jackson looks at the new legislation and the exposure limits it stipulates....FULL STORY
All round protection (10 May 2010)
Wilson Process Systems (WPS) is seeing an increase in the use of resin encapsulation as a quick, simple and cost-effective method of protecting against shock, vibration, moisture ingress and intellectual property theft....FULL STORY
Strong demand for double print technology (06 May 2010)
Applied Materials has announced that it expects its Esatto Technology to be used in more than 2 gigawatts of annual cell manufacturing capacity in the next few months at customer sites in China, Taiwan and Europe....FULL STORY
Trends in Test – 1. Standardise to Optimise Your Test Strategy (30 April 2010)
This is the first in a series of articles, written for EMTww by National Instruments, looking at emerging Trends in Test. We kick off the series with a look at standardisation...FULL STORY
Selecting the right ATE (08 April 2010)
The ongoing reduction in size of PCBs and the components that are mounted on them, coupled with the increasing complexity of the circuits, poses a growing challenge for the engineer who needs to select an ATE system that will last....FULL STORY
Bringing conformal coating into the production line (07 April 2010)
Conformal coating is now typically a standard process rather than an exotic special treatment. It must therefore deliver its full protection potential without compromising mainstream PCB assembly throughput or quality. Andy Bonner looks at how techniques drawn from AOI/AXI inspection experience, coupled with automated selective coating, ensure that this happens....FULL STORY
JTAG – what can it do for you? (06 April 2010)
Boundary scan technology has had to evolve quickly. Mario Berger takes us on a whistle-stop tour of the the past, the present and what is now emerging for the future....FULL STORY
Streamlining with through hole reflow (16 March 2010)
Anything that can streamline production processes and reduce costs has to be of interest to manufacturers. Ian Langeveld of Wieland Electric explains how connectors with ‘through hole reflow technology’ can make a contribution....FULL STORY
Graphene electronics (12 February 2010)
A one-step process that produces both n-type and p-type doping of large-area graphene surfaces could facilitate the use of the promising material for future electronic devices....FULL STORY
SLAC National Accelerator Laboratory selects Corelis (04 February 2010)
Corelis ScanExpress boundary-scan toolset has been installed at the SLAC National Accelerator Laboratory for use in the Reconfigurable Cluster Element (RCE) initiative, led by Mike Huffer and supported by Information Systems Specialist, Chris O’Grady....FULL STORY
Digital screen printer accelerates prototype production (21 January 2010)
A recent development in industrial production technology has been the ability to print onto plastic and metal surfaces using digital flat bed printers....FULL STORY
PEC for LED interconnection (18 January 2010)
PCB mounting of LEDs has so far been limited to mechanical interconnection or the use of PCBs built on thermally conductive copper clad aluminum substrates. Mike DuBois of Caledon Controls looks into the subject....FULL STORY
Automate or die! (15 January 2010)
That’s the warning from Stirling Paatz of specialist robot integrator and supplier, Barr & Paatz. Robot investment in China is booming and reports state that demand for robots is increasing in Eastern Europe and South East Asia, as well as India and Russia....FULL STORY
Revolutionary technology for manufacturing micro-scale devices (08 January 2010)
Cranfield University has developed new technology that could significantly reduce the manufacturing cost of complex micro-mechanical and micro-optical devices....FULL STORY
When two worlds collide (09 December 2009)
Testing electronic boards requires more sophisticated tools that must be fast and easy to use, and meet the requirements of high quality and cost-effectiveness for the manufacturing and repair environment. Luca Carli, Product Manager at Seica SpA (Italy) looks into the subject....FULL STORY
Chosen in a heartbeat (08 December 2009)
Heart rate training technology company, Polar, and Cencorp, a supplier of end of line automation solutions for manufacturing, have together achieved outstanding results using Cencorp’s laser welding technology....FULL STORY
JTAG for Functional Test (14 October 2009)
James Stanbridge, UK Sales Manager for JTAG Technologies, explains how combining boundary-scan with an open-source language is a perfect match....FULL STORY
Solar power is in the bag (14 October 2009)
Solar harvesting has never been so portable as dye-sensitised solar cell technology makes a fashionable debut....FULL STORY
The drive towards hybrid test (07 October 2009)
Today, there are a multitude of different platforms and bus technologies around which automated test systems can be architected. PCI, PXI, LXI, GPIB, USB and VXI are the most widely used, but when compared, there are clear advantages and drawbacks to each. So how do you decide which is the best architecture for your application?...FULL STORY
Achieving efficiency! (02 October 2009)
As engineers try to get their designs cost reduced by integration, and marketers are trying to open-up new markets, production managers, quality control managers and company directors are faced with a dilemma… how do we stay afloat in a declining market?...FULL STORY
Using JTAG emulation for board-level functional test (28 September 2009)
As chip packaging and interconnectivity have become more dense and operate at higher clock frequencies, physical access for traditional bed-of-nails testing becomes limited....FULL STORY
Non volatile response to keeping electronics clean (18 September 2009)
One company making a big splash at Productronica this year is Electrolube who is using the show to launch its latest range of non-VOC products. Tim Fryer talked to the company’s R&D Manager Jade Bridges about the the VOC market....FULL STORY
Vehicles drive energy harvesting forward (07 September 2009)
In 1834, Thomas Davenport demonstrated the first electric car in the UK. Dr. Peter Harrop, Chairman of IDTechEx, explains the importance of electric vehicles in the 21st century....FULL STORY
Stencil selection for perfect printing (10 August 2009)
There are three fundamental stencil technologies available to the electronics assembler today; chemical etching, laser cutting and electroforming, but how should you choose between them? Martyn Penfold, Managing Director of The Solder Connection explains....FULL STORY
Wired up (31 July 2009)
A supplier of power and distribution transformers is using the latest Cropico ohmmeter to improve the resistance testing of its units during the manufacturing process....FULL STORY
A Reely good way of checking aMounts (09 July 2009)
Continental Automotive Components has implemented Seratel’s Reel aMounts counting and labelling system for electronic components at its factory in Penang, Malaysia....FULL STORY
Revolutionising ERP (26 June 2009)
A multifunctional PCB, integrating sensor and evaluation electronics, has passed initial customer production release tests....FULL STORY
Trends in Test part 5 – Protocol aware test (09 June 2009)
This is the final instalment in which National Instruments looks at trends in test, which this month focuses on protocol aware test....FULL STORY
Axiom has pop at packaging (15 May 2009)
Axiom Manufacturing Services, has received a warm response from OEM customers to the introduction an innovative space-saving technology....FULL STORY
SPC controls solder (08 May 2009)
When one manufacturer of PCBs realised that a proportion of its finished boards were failing final quality inspection due to inconsistent solder height, it turned to NWA Quality Analyst’s Statistical Process Control (SPC) software to help out....FULL STORY
Trends in Test part 4 – Explosion of wireless (05 May 2009)
In the penultimate instalment, National Instruments looks at trends in test. This month focuses on the explosion of wireless....FULL STORY
Making the link (17 April 2009)
Wireless camera systems developer, Link Research, has partnered with Briton EMS, a UK CEM with RF capability and boundary scan test experience....FULL STORY
Trends in Test part 3 – Easier access to FPGA-enabled instrumentation (16 April 2009)
In the third of five instalments, National Instruments looks at trends in test. This month focuses on FPGA-enabled instrumentation....FULL STORY
Collect and pick for balanced lines (16 April 2009)
A hybrid placement head from Siemens is claimed to bring users multiple benefits and well balanced SMT lines....FULL STORY
LXI helps engineers across the globe……literally! (10 November 2008)
Gary Raposa of Agilent Technologies looks at the impact that LXI can have...FULL STORY
Printed Electronics on the Horizon (17 October 2008)
Simon Clasper takes a look at emerging and future applications for the screen printer....FULL STORY
Mobile makers demand better test (13 October 2008)
Maintaining competitiveness in the terminal supply market requires continuous innovation not only in the design of new features but also in driving down cost. Tim Carey looks at how a different quality assurance test paradigm is helping to lower manufacturing cost....FULL STORY
Embedded packaging comes of age (22 September 2008)
IMB (Integrated module board) technology offers OEMs/ODMs a fast and cost effective route to enhanced miniaturisation and electrical performance....FULL STORY
2011: The year of OLED lighting? (08 September 2008)
Recent developments and announcements from developers of OLED technology seem to be pointing towards the conclusion that 2011 will be the year where the first commercial OLED lighting applications will appear on the market....FULL STORY
PCB technology - today and tomorrow (26 August 2008)
EMTww asked Tim Dennis Price of Merlin Circuit Technology to outline a technology roadmap for the next few years…...FULL STORY
Anti-counterfeiting technology for aerospace (04 August 2008)
The articles Fake parts, real threat and Genuine solutions to the counterfeit problem hit a chord with many EMT Worldwide readers, and we were recently contacted by Lyncolec about their work in embedding RFID tags in PCBs....FULL STORY
Strategies for cutting contamination (21 July 2008)
One of the key issues facing the electronics production environment today is the impact of contamination. Dust and other particles cause rework, reduced yields and wastage. Sheila Hamilton looks at the problems and solutions....FULL STORY
Tests prove coating credibility (23 June 2008)
Ling Zou and Chris Hunt report on a test method for assessing conformal coating protection performance of electronic assemblies being used in harsh environments...FULL STORY
Meeting green challenges in miniaturisation (12 May 2008)
The world is moving rapidly toward green manufacturing. The miniaturisation trend of the electronics industry is constantly imposing new criteria, making the selection of ideal Pb-free alloys a moving target. Dr. Ning-Cheng Lee looks at the challenges poses by miniaturisation to both solders and fluxes....FULL STORY
OCCAM results in simplicity without solder (14 April 2008)
There have been excited murmurings of late about a new process that could challenge the way electronic circuits are manufactured. This solderless technique, the OCCAM process, is outlined here by Joseph Fjelstad ...FULL STORY
Data streaming in terabytes with PXI Express (18 March 2008)
Scott Savage demonstrates why the PCI Express bus gives PXI Express the performance needed for the most data intensive applications....FULL STORY
INTRODUCTION - Champagne and cake as the Alliance celebrate (18 March 2008)
Loofie Gutterman, President of the PXI Systems Alliance, introduces our supplement this year with a look back at the impact has made since its inception 10 years ago, and how the PXISA celebrated reaching this milestone....FULL STORY
Testing the bus for auto safety (17 March 2008)
Manfred Schneider takes a look at how a PXI-based system was used to test CAN and LIN network characteristics of control units to assure the reliability of bus systems in motor vehicles ...FULL STORY
Breakthroughs in electronic inks (11 February 2008)
Science fiction writer Arthur C Clarke famously said that any sufficiently advanced new science is indistinguishable from magic. The dream of printing electronics onto and into anything sounds pretty magical, particularly when it is said to involve creating bionic man, having edible electronics, smart clothing, skin patches that deliver drugs according to the need that they sense, writes Dr. Peter Harrop of IDTechEx. ...FULL STORY
Quick scan of past and future (14 January 2008)
An overview of boundary-scan’s past, present and future, including the trends that are making this test technique increasingly popular ...FULL STORY
Metal provides solution just in TIM (26 November 2007)
As today’s technology devices continue to get smaller and more powerful, the need for high performance thermal interface materials is becoming more critical. Jordan Ross and Bob Jarrett claim metal thermal interface materials are the ideal solution to fill this need. ...FULL STORY
Premiering at Productronica (22 October 2007)
DJK will introduce a new solder inspection machine at upcoming Productronia....FULL STORY
The future now (15 October 2007)
Continuing our look at companies who intend to make a splash at Productronica, DEK turns the focus on applications based solutions.....FULL STORY
Protecting BGA packages (08 October 2007)
Al Lewis, Director of Marketing and Applications at Asymtek, looks at how automated dispensing of edge bonding protects BGA packages ...FULL STORY
Future for PCB manufacturing (25 September 2007)
The number of PCB manufacturers has drastically reduced from the hundred or so that were around a decade ago. Lee Lloyd of Spirit Circuits gives an overview of the market, and examines why there still is a future for PCB manufacturing in the UK....FULL STORY
Micro electronics builds on British brains (25 September 2007)
Paul Hill of C-MAC MicroTechnology looks at the how the European specialist microelectronic manufacturing industry has developed in the past fifty years....FULL STORY
The next 25 years – Part III (10 September 2007)
In the final part of the series, Sue Knight, Technical Chairman of SMART Group/STI Ltd, gives a personal view of what is come in the next 25 years...FULL STORY
The Next 25 Years - Part II (23 August 2007)
In the second in this short series, Peter Grundy from The SMART Group's technical committee gives us his personal view of what the future has in store for the electronics manufacturing industry ...FULL STORY
Can 1982 be 25 Years Ago? (13 August 2007)
EMTWorldWide asked the SMART Group to gaze into their crystal balls and predict what would happen in the next 25 years. Ron Lasky was first up and started by taking a quick look back 25 years to 1982 – the year Electronics Manufacture & Test magazine was launched....FULL STORY
Maximising test coverage with boundary scan (05 July 2007)
Boundary scan is still not the obvious option that it should be when deciding on a test strategy, argues Reg Waller, European Sales Director of ASSET InterTech...FULL STORY
Driving test towards the right balance (05 July 2007)
Automotive electronics is in a rock and a hard place situation – it requires the volumes and therefore cost pressures of high volume, yet needs the quality and reliability of aerospace. The test regime must therefore play an important role in automotive electronics manufacture, as Antonio Grassino, President of Seica, discusses...FULL STORY
Europe taking the lead in printed electronics (22 June 2007)
Dr. Peter Harrop, Chairman of IDTechEx explains how Europe is taking global leadership in Printed Electronics...FULL STORY
STEP stencils – what are they and how to use them (18 June 2007)
Axel Lindloff, who works for the Process Engineering department of DEK Printing Machines, looks at the uses, types and process considerations of step stencils....FULL STORY
Accurate data closing the manufacturing loop (29 May 2007)
Peter Conlon explores the changing role of AOI in the manufacturing loop....FULL STORY
Metallurgy and Soldering (29 May 2007)
Eric Dawson of Pertego Ltd sheds some light on Metallurgy ...FULL STORY
Standing on a new platform (07 April 2007)
Europlacer has launched its new SMT platform at February’s APEX...FULL STORY
Keeping on level with 3D (07 March 2007)
BGA and other high pin-count packages are particularly susceptible to coplanarity errors, but many manufacturers are failing to use adequate inspection techniques to detect these. Adaptsys’ Dan Eames outlines the options....FULL STORY
Reworking lead-free array packages (07 January 2007)
Craig Brown focuses on heating, the biggest issue introduced by lead-free rework, and how best to reflow array package components on large double-sided PCBs ...FULL STORY
Flexible test remains upwardly mobile (07 December 2006)
Reports of the death of in-circuit test are much exaggerated, says Mike Smith, who argues that ICT plays an important part in the development of a global product. ...FULL STORY
Avoiding electro-chemical failure (07 December 2006)
SIR testing has proved invaluable for high reliability electronics manufacturers that need to underwrite the long-term, field reliability of their products. But the move to lead-free solders has led to a review of the technique. Graham Naisbitt explains ...FULL STORY
One bus or any bus? (07 November 2006)
Ian Bell, Technical Marketing Manager at National Instruments talks about next generation test system architecture ...FULL STORY
50 years of wave solder (07 November 2006)
How wave solder came to light...FULL STORY
Dross recovery (07 October 2006)
While the higher costs of lead-free solder is less of an issue when it is printed, the additional cost for filling a solder bath are considerable. With more dross being created at lead-free's higher process temperatures, it looked like a double-whammy for users of flow solder machines. The losses can, however, be kept to a minimum as EM&T found out. ...FULL STORY
Cradle to grave (07 October 2006)
Michael Zahn, Product Manager, VectorGuard, of DEK Printing Machines says that the most efficient and least-risk approach for vendors of assembly technologies to meet the demands of modern assemblers is to actively manage each enabling technology from birth to obsolescence. ...FULL STORY
Essential support (07 September 2006)
Novatec, a research laboratory based in France developing new technologies for the electronics assembly industry, have recently developed VacuNest ...FULL STORY
Cleaning in batches (07 September 2006)
Tom Forsythe of Kyzen looks at a 'by the numbers' approach to low cost of ownership in batch cleaning systems ...FULL STORY
Oxford Instruments (07 September 2006)
One of the issues with the industry's move to lead-free is that of proof. Proof that your incoming components and boards are compliant, and proof that your (and your competitors) assemblies are lead-free as well. Neal Robson describes an instrument that fills this gap. ...FULL STORY
RoHS less rosy from across the pond (07 July 2006)
Over here in Europe we have only got ourselves to blame for the consequences of our own legislation. Recently, of course, we have exported some of these issues 'across the pond'. Chuck Dow of Lantronix discusses the impending RoHS legislation and its global implications ...FULL STORY
Tips on tips (07 July 2006)
Solder tip life has long been a contentious subject and it is now exacerbated by the higher temperatures of lead-free soldering. Cooper Tools has prepared a practical guide to help users extend solder tip life, which we have summarised in this article ...FULL STORY
Looking beyond RoHS & WEEE (07 June 2006)
If you've struggled through to RoHS compliance, the bad news is 'there's more to come'. German Avila describes some of the challenges of further environmental legislation and goes on to explain how IT can help solve some of the headaches. ...FULL STORY
Is LXI the future of test ? (07 June 2006)
With the launch of the LXI Consortium in September 2004 and the definition of the LXI specification just a year later it is now possible to review the benefits that this new interface standard brings. Stefan Koop outlines 10 good reasons why many perceive LXI as the way forward for test system interfacing. ...FULL STORY
How safe is the lead-free environment? (07 June 2006)
The aim of the LEADOUT project is the removal of lead from solders and pastes in electronic circuits, so it is important to study the environmental aspects of this change. That is why it is essential to quantify the environmental effect of the present SnPb solders and pastes and to compare them with the lead-free solders and pastes. Dr. Patricio Aguirre gives an update of the project's progress ...FULL STORY
Printing power for fuel cell technology (07 May 2006)
Familiar technology in unfamiliar surroundings - Darren Brown explains how the stencil printer could be a key component in the commercial success of fuel cell technology ...FULL STORY
Profits up when dead boards go down (07 May 2006)
A major concern for both OEMs and contract manufacturers is excessive board scrap, as this impacts their profits. Completely 'dead' boards and difficult to trace faults are the primary causes. However, a low skill and mobile labour force also contribute. A cost effective solution is needed to this problem, as Billy Fenton reports ...FULL STORY
Look carefully for the right optical equipment (07 May 2006)
There is a multitude of vendors of Automated Optical Inspection systems for assembled PCBs. Selecting the “right” supplier is an extremely challenging task with possibly far reaching consequences. Jens Kokott and Steve Hooper discuss the considerations ...FULL STORY
Trends demand placement performance (07 May 2006)
This article outlines the technology drivers in the electronics industry and shows how one equipment manufacturer is responding to them ...FULL STORY
Changing face for UK electronics (07 April 2006)
A number of initiatives are aimed at pulling together the diverse UK electronics industry, to give it more direction and a louder voice. John Higgins, Director General of Intellect, outlines developments ...FULL STORY
Time to look at what's hot in test (07 April 2006)
Test strategies are being put to the test in our brave new lead-free era, but all equipment needs to have the right balance of capability and cost. Kaisertech is launching two new systems at Nepcon aimed at finding this balance for many manufacturers. ...FULL STORY
Closer look at lead-free joints (07 March 2006)
The quest for knowledge about lead-free solder joints takes many forms. In this paper M.H. Biglari and F. Kox discuss their experimental process and results for assessing voiding in joints. ...FULL STORY
Preparing for a solvent solution (07 March 2006)
A massive requalification process is currently underway to identify, test, certify and learn to use new materials, chemicals and processes in time for July this year, when the ban on lead in most electronics products sold in Europe will come into force. Phil Kinnear argues that it would save time and money to look at conformal coatings at the same time. ...FULL STORY
Lightning adds flexibility to placement (07 March 2006)
This appears to be the age of the modular placement platform, yet the use of new head technology can further increase the flexibility of this equipment. ...FULL STORY
Pb-free era (07 February 2006)
BGA rework is a critical process in the Pb-free era. Roger Gibbs describes a number of tools that have simplified the task. ...FULL STORY
Making the print at jet speed (07 February 2006)
One of the talking points at the recent Productronica exhibition was Mydata's new 'stencil-free' printer. Questions were raised about who could afford it, but it is still an interesting piece of equipment. This article describes the machine's vital statistics. ...FULL STORY
Will your BGA fall off ? (07 February 2006)
BIf a board is dropped, is the BGA likely to fall off? This extract from a paper by Keith Newman looks at research into 'BGA Brittle Fracture' and methods to test for it....FULL STORY
Half won't make the Pb-free deadline (07 January 2006)
Our latest survey results show that half of the companies won't have transitioned all their products to Pb-free by the time the RoHS directive comes into effect. ...FULL STORY
Laser versus vision centring (07 January 2006)
Martin Kunz discusses the advantages and disadvantages of component centring using laser or vision systems ...FULL STORY
Pushing back the test boundaries (07 January 2006)
Reduced investment in test hardware and remote testing are just some of the benefits of a new technology in boundary scan. testing ...FULL STORY
|
|
|
|
|