Editorial archive;

News - Research programme on flexible OLED displays (23 January 2012)
Holst Centre and imec have launched a new research programme on next-generation flexible OLED (organic light emitting diode) displays. It builds on their track record and solid base of existing research partners in related fields such as Organic and Oxide Transistors and Flexible OLED Lighting....FULL STORY

News - Holst Centre and Philips Research celebrate five-year collaboration with new contract (24 October 2011)
Since 2005, Philips Research and 35 other industrial partners have combined their innovation power at Holst Centre, an open-innovation initiative by imec and TNO, to take technology in the areas of wireless sensors and flexible electronics to the next level....FULL STORY

News - Partnership for printed logic technology (04 July 2011)
PragmatIC Printing Ltd and Holst Centre, an open-innovation initiative by imec (Belgium) and TNO (Netherlands), have announced their joint collaboration in the research, development and exploitation of flexible electronics....FULL STORY

News - Tests for 3D stacked ICs (27 June 2011)
A new technology supports pre-, mid-, and post-bond testing of dies and TSV-based interconnects, as well as final testing after packaging...FULL STORY

News - Flexible and stretchable collaboration (15 June 2011)
Holst Centre (an open-innovation initiative by imec and TNO) and the Centre of MicroSystems Technology (CMST), imec’s associated laboratory at Ghent University, have announced that they have joined forces on flexible and stretchable electronics....FULL STORY

News - Partnership will stick (15 April 2011)
Henkel and Holst Centre have announced their partnership in the field of flexible electronics. Henkel’s knowledge of adhesives brings a new field of expertise to the Holst Centre’s shared research programmes....FULL STORY

News - Printed electronics research expands with collaboration (18 February 2011)
DuPont Microcircuit Materials (MCM) has announced a collaboration with Holst Centre focused on printed electronics. The collaboration is expected to advance technology in the area of printed structures on flexible substrates....FULL STORY

News - Combining expertise (04 February 2011)
A new partnership will improve CMOS integrated MEMS....FULL STORY

News - AWARD - ‘Device of the Year’ announced (16 December 2010)
At this year’s ISOS-3 conference on OPV stability, Holst Centre’s flexible organic solar cell won the annual ‘Device of the Year’ award....FULL STORY

News - Imec sets-up R&D activity in Taiwan (21 October 2010)
Imec Taiwan has declared that it has signed the co-funding contract with the Taiwanese Ministry of Economic Affairs (MOEA) for its R&D activity imec Taiwan Innovation Centre (ITIC)....FULL STORY

News - MEMS performance improves (22 July 2010)
Imec demonstrates the value of its SiGe above-IC MEMS technology platform for improving performance of state-of-the-art MEMS with the development of new MEMS devices....FULL STORY

News - World’s first application of flexible OLED lighting on foil (14 June 2010)
In this year’s 24 hours Le Mans race, the ORECA01 car from French racing team Oreca used rear view mirrors with an integrated thin film encapsulated Flexible Organic Light Emitting Diode (OLED) on the back....FULL STORY

News - 40nm technologies available to European companies and academia (04 June 2010)
Nanoelectronics research centre, imec, and semiconductor foundry TSMC, have announced the extension of imec’s Europractice IC service with the offering of TSMC’s 40 nanometer technologies....FULL STORY

News - Partner network for roll-to-roll flexible electronics (16 April 2010)
NeoDec, an Eindhoven-based spin-off company from the Eindhoven University of Technology, the Holst Centre, an open-innovation initiative by imec, and TNO, have announced their partnership on metallic inks for flexible electronics applications....FULL STORY

News - 3D stacked IC development collaboration (12 March 2010)
Synopsys and the Belgian nanoelectronics research centre, imec, have announced that they have entered into a collaboration to use Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools for characterising and optimising the reliability and electrical performance of through-silicon vias (TSVs)....FULL STORY

News - Chip design and prototyping collaboration (08 March 2010)
Imec and Altos Design Automation have announce that they have entered into an agreement to set up a library re-characterisation service based on Altos ultra-fast characterisation tools....FULL STORY

News - Micronail chip makes electronics and bio cells communicate (09 November 2009)
A new chip is a mass-producible, easy-to-use tool in electrophysiology research, for fundamental research on the functioning and dysfunctioning of the brain....FULL STORY

News - Flexible relationship (23 October 2009)
Low-cost flexible electronics packaging is just around the corner, thanks to a joint research project....FULL STORY

News - SRC and IMEC sign MOU to jointly accelerate green manufacturing progress (23 February 2009)
Semiconductor Research Corporation (SRC) and IMEC intend to set-up an international collaboration aimed at the creation of novel processes and materials for advanced semiconductor manufacturing. The memorandum of understanding (MOU) calls for the consortia to apply their combined expertise to finding more environmentally friendly ways to make chips for use by the worldwide electronics industry....FULL STORY

News - 3D-SIC demonstrated (10 November 2008)
Independent nanoelectronics research institute, IMEC, has announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology....FULL STORY