0201 Chip Components
07 December 2001
0201 is the latest solution to design and production of miniaturised products - or is it the latest threat to production yields? Based on process trials to date the former is correct, the latter less of an issue than first thought. 0201 chip capacitors and resistors are significantly smaller than 0402 and provide a solution to many of the new mobile communication devices available today and planned for 2002.
0201 chips are 0.020" x 0.010" in size and are currently the smallest components available (although 01005 are considered to be just round the corner). Based on trials to date the printing process can achieve constant results provided the correct pad design is used and the stencil is correctly specified. The paste adhesion to the surface of the pad may be an issue due to the relatively small area of contact. Paste block has been seen to be dislodged during placement. Reflow trials have been very successful unlike some of the published literature. There has been very little incidence of the component movement that was indicated by trials conducted in Japan and the USA. Inspection with x-ray or with automatic optical systems does not seem to be a challenge. Manual inspection will require suitable magnification to see the components let alone the joints. These results are all available in the SMART Group 0201 Charity report currently being compiled.
Placement of components does seem to be the challenge. The quality of the tape and reel packaging has made suppliers re-examine the types of feeders and the way they index product for pick up. Applying ultra small nozzles has been a learning cure for suppliers who, in the main, seem to have the problems under control. Recent trials on lead-free reflow using tin/silver/copper and bismuth alloys have also be successful with 0201 chips.
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