Zero-defect production of safety-critical applications
25 July 2011
With its 3D Co-planarity Module, ASM Assembly Systems GmbH & Co. KG is offering a new option for its SIPLACE SX-Series placement machines.
In addition to verifying missing balls or bent leads via a 3-point laser measurement (laser triangulation and scanning via a laser curtain), the new 3D Co-planarity Module also verifies the planarity of large BGAs and QFPs.
In less than 500 milliseconds (benchmark for a QFP 100 component) and thus significantly faster than traditional 2D co-planarity measurement techniques, the module recognises and rejects components which are deformed beyond a permissible level. This eliminates the need for the traditional function and X-ray tests used to identify open solder joints on deformed components.
With the co-planarity measurement, electronics manufacturers can minimise expensive repairs after the placement process, making the SIPLACE 3D Co-planarity Module an important tool for the zero-defect production of safety-critical applications.
The SIPLACE 3D Co-planarity Module is an option for the placement of large BGAs and QFPs on SIPLACE SX placement machines equipped with SIPLACE CPP MultiStar or SIPLACE TwinHead heads.
In addition to the standard component recognition and inspection with the SIPLACE digital vision system, the 3D Co-planarity Module uses a 3-point laser measurement system to check the leads or balls of BGAs for height variations relative to the ideal placement level, i.e. for deformations.
Since the new 3D laser measurement also minimises any production performance slowdown, the 3D laser measurement takes only a fraction of the time required by traditional 2D methods. On a QFP 100, for example, the system recognises in less than 500 milliseconds whether any component leads were deformed beyond a certain tolerance level defined for this specific component type. Any components recognised as deformed beyond acceptability are discarded or optionally set aside. This significantly reduces the possibility of open or weak solder joints and the costs associated with post-production function or X-ray testing – an important step towards zero-defect production, particularly for manufacturers of safety-critical applications.
The SIPLACE 3D Co-planarity Module also supports automated defect analysis by storing all information about discarded or rejected components in the form of images. The system displays the component profiles graphically and highlights faulty leads. This information can then be used to work with component suppliers on making improvements.
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