3D solder paste inspection
08 March 2010
EMS provider, NBS, has announced the acquisition of four VI Technology post-print automatic Solder Paste Inspection systems for its manufacturing facility in Santa Clara, California.
Its deployment and use of structural test verification technology identified the value of adding the new equipment.
Typically, the need for in-line solder paste inspection is driven by maintaining production line stability and providing notification of process deviation. With extremely frequent change over and often smaller run sizes, NBS has different needs than many other manufacturers.
Director of Engineering at NBS, Jeff Armato, commented: “Adding 3D SPI will enable us to deliver an even higher level of product quality. Our goal is always to meet or exceed the requirements dictated by the product designs from our diverse customer base. Some very specific goals and acceptance criteria had to be met in order for SPI to properly serve our manufacturing environment:
• Printer verification, even on first time builds
• 30 minute or less CAM to board test time
• Minimal false calls
• Data with traceability to downstream inspection and test
Our evaluation of competitive systems in the market was comprehensive. We believe that VI Technology 3D-SPI will more than satisfy our desire for achieving the highest degree of process repeatability while reducing incidents of rework.”
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