Axiom has pop at packaging
15 May 2009
Axiom Manufacturing Services, has received a warm response from OEM customers to the introduction an innovative space-saving technology.
The innovation, known as Package on Package or POP technology, involves the stacking of surface mount components directly on top of each other to create smaller final units and aid the miniaturisation of products.
Launched earlier this year, POP has already sparked interest and growing demand among the firm’s customers, particularly those engaged in the production of hand-held devices with high functionality.
By extending the limits of assembly processes, POP technology also addresses the current need for cost reduction in manufacturing.
In addition, the new stacked design helps increase signal processing performance and memory capabilities, and makes greater use of available circuit board space, removing the need to lengthen or widen the PCB surface area.
The convergence of communications, computer and consumer electronics has increased market demand for greater functionality of small devices, for example mobile phones and PDAs. Axiom believes this trend towards smaller, more sophisticated products, will make POP an indispensable technique.
Dean Taylor, Operations Director at Axiom commented: “At Axiom we pride ourselves on introducing innovative solutions to manufacturing challenges and the Package on Package technology is a prime example of this. After being asked by a customer for a solution to their product need, we worked in conjunction with the firm concerned and with one of our distributors to fully understand and develop what our approach would be.
“We sent a team to Hungary to see the manufacturing equipment in action before making the decision to purchase a new feeder. Prior to this we manually built prototype boards to prove the circuit design for the customer, which was a great success.
“The idea of vertically stacking components during printed board assembly is relatively new idea and demand from our customers for POP technology in their custom-built products is growing rapidly. POP is enabling us to build electronics which have enhanced performance, better space utilisation, greater flexibility during system design and a simplified design system.”
Package-on-Package (PoP) is designed to vertically combine discrete logic and memory Ball Grid Array (BGA) packages. The stacked components use a standard interface to route signals between them.
Utilising POP also means less high-frequency interference in devices manufactured using this method. The processor and memory can be combined freely and consequently the signal integrity is often improved due to less complexity in the printed circuit board (PCB) layout.
Axiom has been using this technology to manufacture a range of products for its clients across the medical, aerospace, defence and industrial manufacturing sectors.
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