RPS deploys selective soldering system at US Navy Centre of Excellence
09 March 2009
Global supplier of selective soldering, lead tinning and solder test equipment, RPS Automation, has announced that it has deployed an advanced robotic selective soldering system at ACI Technologies; a research corporation serving the US Navy Centre of Excellence.

ACI has deployed an Opus III Selective Soldering System from RPS and this system performs precise automated robotic soldering of through-hole and odd form components and lead attach applications. The Opus utilises a top-side gantry with 360 degrees of rotation, 0-10 degrees of programmable tilt and tool-free accommodation of PCBs as large as 455 x 455mm.
The RPS proprietary Gaussian MiniWave Nozzles, from 2mm to 20mm in diameter, deliver tall, stable mini waves of solder that can handle a range of applications, from long leads to tight keep away pin placements. The Opus at ACI is lead and lead-free ready with quick-change solder pots. ACI is also using a six-inch conventional wave nozzle to handle traditional wave processing without the higher cost and maintenance of a wave system.
Ken Friedman, Equipment Advisory Board Co-ordinator at ACI commented: “Our production team is experienced with a wide range of robotic automation equipment and they could not be more pleased with the terrific performance and ease of operation of the Opus System. The RPS team is a great asset, with factory-direct field technicians and process expertise that is rare in the industry today; we have a true partner in RPS.”
Reed Gaither, CEO of RPS, stated: “ACI is committed to evaluating, demonstrating and using the most advanced electronics manufacturing techniques in the world. We are honoured to be selected to provide selective soldering at ACI. This says a great deal about the superb team of engineers and technicians we have at RPS. We have been perfecting this technology for 20 years and this deployment at ACI is a testament to the innovation and superior quality of our US-built systems.”
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