Fluxer spray head reduces flux consumption
26 July 2010
SEHO Systems has completely redesigned the fluxer area of its wave soldering systems, and as a result, both the flux consumption and maintenance times are remarkably reduced, decreasing manufacturing costs in electronics production.
The ATS Spray Fluxer, developed by SEHO, has several advantages. In this closed system, a rotary pump continuously transports the flux from the flux container into a bypass system. For spraying, a bypass valve interrupts the circuit and leads the flux to the spray head.
The new spray head uses HVLP technology (high volume, low pressure) that generates atomisation of the flux with a comparatively low pressure. This ensures a stable spray jet with a homogeneous spray pattern and an extremely good boundary at the outer edges to enable a reduction of the flux consumption. Overall, this low-pressure system creates considerably less spray mist, reducing soiling in the fluxer area and minimising maintenance requirements.
With the ATS Spray Fluxer, flux quantity and spray pressure are adjustable. All connections are designed as quick-acting closures and the spray head is quickly exchangeable. Additionally, the flux container, which is equipped with an additional cover, can be taken out completely to allow easy cleaning. All electrical and pneumatic parts remain in the soldering system.
The ATS Spray Fluxer with HVLP technology is available for all wave soldering systems from SEHO and may be refitted for older machines.
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