Pb-free paste for humid regions
30 April 2010
Henkel has launched Multicore LF620; a new no-clean, halide-free, lead-free solder paste that has a broad process window for printing, reflow and humidity resistance.
The rigorous engineering at the foundation of Multicore LF620 ensures its consistent print performance with minimal hot slump, even in regions with temperatures of 30°C (86°F) or more and relative humidity (RH) upwards of 80%.
Formulated with a new activator chemistry, Multicore LF620 exhibits extremely low voiding in CSP via-in-pad joints, good coalescence and excellent solderability over a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. In addition, the material’s versatility delivers outstanding printability at low or high speeds, with brick-like print definition, yielding vast improvements in throughput while also ensuring consistency of print deposits. “The capabilities of Multicore LF620 make it the ideal choice for manufacturers of today’s highly miniaturised devices,” states Dr. Mark Currie, Henkel Global Product Manager. “For multi-functional complexly populated boards and for smaller handheld devices that dictate finer-pitches (0.4mm and above), reduced board sizes and increased functionality, Multicore LF620 offers unmatched performance and processability.”
In addition to the handheld market, LF620 is suited to the automotive sector, as the material has a wide reflow process window accommodated by its robust flux system. “Though much of the electronics assembly industry has settled into current lead-free manufacturing processes, Henkel believes there is room for innovative improvement,” concludes Currie.
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