A boost for rework capacity
26 November 2009
OK International’s APR-5000 XL/XLS Array Package Rework System capabilities have been enhanced by the recent release of new software that allows the simultaneous use of inner and outer preheaters, enabling fast and easy profiling.
The total productivity of the unit has been increased by reducing rework cycle time and protecting the component under rework from thermal damage. The new design permits a lower nozzle temperature to achieve the same required temperature at the solder joints or balls while reducing BGA lid temperatures; a significant source of failure by thermal damage. The APR-5000 XL/XLS improves its ability to manage the narrow lead-free process window without using excessive peak temperatures that may damage components, connectors, adjacent solder joints and the PCB substrate.
During the rework process, the APR enables the simultaneous use of the inner and outer preheaters at programmable temperatures. This provides faster profiling and precise thermal control across critical assembly regions. In most applications, the preheater nozzle and reflow top nozzle can be used at the same temperature in the final zones to easily achieve target temperatures. New software on the APR-5000 system dramatically simplifies rework for a faster, safer and more repeatable performance, enabling quick, simple profiling.
The APR-5000 XL/XLS Array Package Rework System provides large board capability with small board precision. This system performs precise, cost effective rework of the widest range of PCBs and component types, from large boards up to 622mm x 622mm, to components down to 0.51mm x 0.25mm.
In addition, the APR-5000 XL/XLS Array Package Rework System features an innovative Split Vision System, which allows operators to simultaneously view the opposite corners of a component, including splitting on rectangular components, with the high-powered magnification to make placement and registration fast and accurate.
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