Headlines
When a team of university and industry researchers tried a novel, foundry-style mould-filling technique to make nanoscale devices, they realised they had discovered a gem Nano-foundry technique yields ultra-durable probes
When a team of university and industry researchers tried a novel, foundry-style mould-filling technique to make nanoscale devices, they realised they had discovered a gem.
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Action needed to promote ecological recycling
UBA President Jochen FlasbarthMore than 155,000 tonnes of what is sometimes hazardous electronic waste is exported annually from Germany to non-European destinations, a volume which includes some 50,000 tonnes of PC and television monitors alone.
MORE...		 Clear signs of economic recovery
IPC has released the Winter 2010 edition of Electronics Industries Market Data Update, which offers proof of a continuing economic recoveryIPC has released the Winter 2010 edition of Electronics Industries Market Data Update, which offers proof of a continuing economic recovery.
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Consortium starts Supreme project
Jeroen de Groot, Assembléon’s Marketing DirectorAssembléon has started a research project to develop a new generation of sustainable pick and place solutions for the electronics assembly industry.
MORE...		 From the wires....
Large award for research

Samsung appoint Young Electronics Group as distributor

HP clarifies policy

PartnerTech's new CEO

Koh Young expands

UK and India launch £10m collaboration

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What's new on site Recovery challenges – balancing capacity and demand MORE...

Nano-foundry technique yields ultra-durable probes MORE...

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Technology
TECHNOLOGY IN ACTION
Researchers Raghunath Murali and graduate student Kevin Brenner (front) perform electrical measurements on a graphene sample under high vacuum in a cryogenic probe station Graphene electronics
A one-step process that produces both n-type and p-type doping of large-area graphene surfaces could facilitate the use of the promising material for future electronic devices.
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JARGON BUSTER
Copper dissolution of the copper plating and foil during selective soldering Copper dissolution
Dissolution/erosion of the plating or coating is not a new issue, but with the introduction of lead-free soldering materials, new process stages like selective soldering and higher process temperatures, it is a real issue, as the pictures show.
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CASE STUDIES
3D solder paste inspection
The VI Technology 3D-SPI Systems were chosen for their ability to meet the demanding requirements of NBS’ manufacturing processes EMS provider, NBS, has announced the acquisition of four VI Technology post-print automatic Solder Paste Inspection systems for its manufacturing facility in Santa Clara, California.
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Central issues at a critical time
Ruth Porter Debates about how best to ensure that British industry is competitive are taking on increasing importance as we near a general election.
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DIARY & EVENTS: Coming soon
24/02/2010 HazardEx 2010 - The Awards (UK)
08/03/2010 2010 Lean and Six Sigma Conference (USA)
09/03/2010 IC Card World 2010 (Japan)
09/03/2010 New Technology Days (UK)
09/03/2010 The Best of British in Consumer Electronics (UK)

Next Exhibition Preview:
Products
Eliminating production errors
The Cycle Stop Controller The Cycle Stop Controller, an Ethernet enabled device that electrically integrates with the cycle stop circuit of any machine type, has been launched by Cogiscan.
MORE...		 Recycling solder paste
Seika’s new Solder Paste Recycling Unit Seika’s new Solder Paste Recycling Unit enables approximately 90% of waste solder paste to be recovered as solder bar.
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