Headlines
University of Manchester joins UK Electronics Skills Foundation University of Manchester joins UK Electronics Skills Foundation
Top ranked UK EE Engineering school signs up to help reverse industry threatening decline in UK electronics students.
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Super Dry reports 37% revenue surge
Super Dry by Totech has reported ongoing growth in its Americas Sales Division for Q1 2012Super Dry by Totech has reported ongoing growth in its Americas Sales Division for Q1 2012. “We are extremely pleased that year on year Q1 revenue increase of 37% has surpassed all previous estimates,” reported Totech EU BV Managing Director Jos Brehler. “This is also another clear sign that comprehensive MSD management practices are gaining wider attention in North America.”
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Space selection
IPC Sales Director Mary Mac KinnonFollowing showers of praise at IPC APEX EXPO 2012, the number of exhibitor contracts for the 2013 event is nearing double-digit growth over the same time last year. On 22 May 2012, IPC will begin the space selection process for the 2013 show in San Diego.
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Agilent named oscilloscope company of the year
Agilent named oscilloscope company of the yearAgilent Technologies has received the 2011 Global Frost & Sullivan Award for Company of the Year for its performance in the oscilloscope market.
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From the wires....
Bittele Electronics announces partnership with Xptronics

Anti counterfeiting seminar

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What's new on site New metrology CT system MORE...

SmtXtra move to new 12,000 sq ft head office in UK MORE...

ShortList update
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Links
Connecting you to electronics associations and organisations around the world...
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Technology
TECHNOLOGY IN ACTION
Customised RFID tags speed throughput of leak testing Customised RFID tags speed throughput of leak testing
Electronic product manufacturers seeking high standards of lean manufacturing by using RFID tags for tracking and identification can now use an electronic label system built by Uson.
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JARGON BUSTER
Desoldering is the removal of solder and components for troubleshooting, for repair purposes, component replacement, or to salvage components Solder wick or braid
Desoldering is the removal of solder and components for troubleshooting, for repair purposes, component replacement, or to salvage components.
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CASE STUDIES
Future Electronics launches specialist RF division

Future Electronics launched Future RF and Wireless Solutions, a specialist division with the task of helping OEMs to bring RF-enabled end products to market efficiently and successfully.


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MANAGEMENT
YesTek is now AOI Systems
Scottish AOI specialist YesTek Limited has changed its name to AOI Systems Limited.
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DIARY & EVENTS: Coming soon
15/05/2012 International Conference on Soldering and Reliability (Canada)
22/05/2012 Webtorial: Cleaning Innovations Needed to Clean Highly Dense Assemblies (Online)
22/05/2012 Sensor + Test 2012 (Germany)
22/05/2012 POP, LGA, QFN Desing & Assembly Workshop (UK)
23/05/2012 ElectroTestExpo (UK)

Next Exhibition Preview:
Products
New system for 3D solder paste inspection
New system for 3D solder paste inspection GOEPEL electronic recently introduced a new system for 3D solder paste inspection (SPI). The solution, named OptiCon SPI-Line 3D, provides high level technology by extraordinary inspection speed and detection accuracy for automatic solder paste inspection.
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Nano-forms epoxy preforms for sealing sub-miniature electronics
Nano-forms epoxy preforms for sealing sub-miniature electronics Multi-Seals’ Nano-forms epoxy preforms provide precision seals on microelectronics. With preforms as small as 0.035in (0.89mm) outside diameter and 0.011in (0.28mm) inside diameter, Nano-forms allows highly repeatable placement of minute amounts of epoxy with precision that is unattainable with traditional dispensing methods.
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